COPPER FLEX CIRCUITS

Product Designation
Description
Typical Cure
Electrical Resistance
Ohms/Sq/Mil
CI-1031-7
Silver thermoset ink, highly conductive for silver jumpers or EMI/RFI printed shield pattern
10 Min. @ 300°F
<0.010
CI-2002
Carbon ink for jumpers, resistors, shunts, or copper top-coat
10 Min. @230° F.
<20.0
DB-1501
One component stencil print silver adhesive
<6 Min @285° F
0.0004 ohm-cm
DB-1527
Two component needle dispense silver SMT adhesive
5 Min @ 120° C
0.003 ohm-cm
DI-7008 A/B
Solvent based dielectric
5-10 Min. @ 230°F
>1,000 Mega ohms
DI-7503
Flexible UV curable dielectric

450 millijoules per Square Centimeter

>1,000 Mega ohms
EC-9519
UV curable encapsulant, flexible

450 millijoules per Square Centimeter

>1,000 Mega ohms